| 2011 |
| Build up Materials |
Aramid, BT, FR4, LD Prepreg, RCC |
Structure
- Sequential Build-up
- Sequential Lamination |
Up to 3+N+3 with IVH
Up to 3 X IVH (microvia) |
| Minimum Line Width/ Spacing |
3 mil/ 3 mil
(3/4 mil for via filling design) |
| Minimum/ Maximum Laser Via Size |
2 mil/ 8 mil |
| Laser Via Formation Method |
Conformal Mask, Direct Drilling |
| Laser Via Filling |
Copper Plating |
| Aspect Ratios |
1:1 |
| Impedance Control |
+/- 7% |
