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| Microvia | |
| ¡¡ | 2019 |
| Build up Materials | Aramid, BT, FR-4, LD Prepreg, RCC |
| Structure -Sequential Build-up -Sequential Lamination |
Up to 3+N+3 with IVH Up to 3 X IVH (microvia) |
| Min. Line Width/ Spacing | 75 µm/ 75 µm |
| Laser Via Size | 50 ~200 µm |
| Laser Via Formation Method | Conformal Mask, Direct Drilling |
| Laser Via Filling | Copper Plating |
| Aspect Ratio | 1:01 |
| Impedance Control | +/- 7% |
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