Build up Materials Aramid, BT, FR-4, LD Prepreg, RCC
 -Sequential Build-up
 -Sequential Lamination

Up to 3+N+3 with IVH
Up to 3 X IVH (microvia)
Min. Line Width/ Spacing 75 µm/ 75 µm
Laser Via Size 50 ~200 µm
Laser Via Formation Method Conformal Mask, Direct Drilling
Laser Via Filling Copper Plating
Aspect Ratio 1:01
Impedance Control +/- 7%

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