 |
 |
 |
 |
 |
 |
 |
 |
| Backplane | |
| ¡¡ | 2019 |
| Layer Count | Up to 46L |
| Min. Line Width/ Spacing | 75 µm/ 75 µm |
| Aspect Ratio | 20:01 |
| Thickness Tolerance | +/- 8% |
| Min. Core Thickness | 50 µm |
| Copper Foil | 1/3 to 5 oz |
| Max. Panel Size | 610mmx 915mm |
| Max. Board Thickness | 6.4mm |
| Press Fit Hole Tolerance | +/- 50 µm |
| Impedance Control | +/- 5% |
|
