Conventional PCB
Layer Count Rigid PCB from 2L to 46L
Base Materials FR-4, High Tg FR-4, BT, Rogers, Getek, Thermount, PTFE, Hybrid, Halogen Free, Lead-Fress, Anto-CAF, Nelco-13, Arlon, High Speed, Low Loss
Min. Core Thickness 50 µm
Copper Foil 1/3 to 5 oz
Surface Finish Lead-Free HASL, OSP, ENIG, ENEPIG, Immersion Tin, Immersion Silver, Selective ENIG/ OSP, Electrolytic Gold, Carbon Ink
Min. Hole Size 150mm
Min. Line Width/ Spacing 75 µm/ 75 µm
Solder Mask Photo Imageable, Peelable Type
Impedance Control +/- 7%

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