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| Conventional PCB | |
| ¡¡ | 2019 |
| Layer Count | Rigid PCB from 2L to 46L |
| Base Materials | FR-4, High Tg FR-4, BT, Rogers, Getek, Thermount, PTFE, Hybrid, Halogen Free, Lead-Fress, Anto-CAF, Nelco-13, Arlon, High Speed, Low Loss |
| Min. Core Thickness | 50 µm |
| Copper Foil | 1/3 to 5 oz |
| Surface Finish | Lead-Free HASL, OSP, ENIG, ENEPIG, Immersion Tin, Immersion Silver, Selective ENIG/ OSP, Electrolytic Gold, Carbon Ink |
| Min. Hole Size | 150mm |
| Min. Line Width/ Spacing | 75 µm/ 75 µm |
| Solder Mask | Photo Imageable, Peelable Type |
| Impedance Control | +/- 7% |
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