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| High-End Server | |
| ¡¡ | 2019 |
| Layer Count | Up to 46L |
| Min. Line Width/ Spacing | 50 µm/ 50 (Inner) & 75 µm/ 75 µm (Outer) |
| Aspect Ratio | 20:01 |
| Thickness Tolerance | +/- 5% |
| Min. Core Thickness | 50 µm |
| Copper Foil | 1/3 to 5 oz |
| Max. Panel Size | 610mmx 813mm |
| Max. Board Thickness | 6.0mm |
| Press Fit Hole Tolerance | +/- 50 µm |
| Impedance Control | +/- 5% |
| I/O Count for a Single Chip Module | 7300 @1.0mm > 7300 @1.omm pitch (Land Grid Array) |
| Size of Chip¡¯s Package | 100mm x 100mm |
| Depth Tolerance of Back Drilling | +/- 0.1mm @0.25mm via |
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