High-End Server
2019
Layer Count Up to 46L
Min. Line Width/ Spacing 50 µm/ 50 (Inner) & 75 µm/ 75 µm (Outer)
Aspect Ratio 20:01
Thickness Tolerance +/- 5%
Min. Core Thickness 50 µm
Copper Foil 1/3 to 5 oz
Max. Panel Size 610mmx 813mm
Max. Board Thickness 6.0mm
Press Fit Hole Tolerance +/- 50 µm
Impedance Control +/- 5%
I/O Count for a Single Chip Module 7300 @1.0mm > 7300 @1.omm pitch (Land Grid Array)
Size of Chips Package 100mm x 100mm
Depth Tolerance of Back Drilling +/- 0.1mm @0.25mm via

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