Quick Turn Around Services
Layer Count Up to 32L
Max. Panel Size 458mmx 610mm
Base Materials Low CTE/ High Tg FR-4, Halogen Free, BT Epoxy, Getek ML200, Nelco N400-13 EP/ SI, Rogers RO4350/ RO003C, Arlon 25FRm RF408, Megtron 4, Megtron 6, R1755V, Hitachi E679F(J)/ E679(W)
Min. Core Thickness 50 µm
Copper Foil 1/2 to 5 oz (Inner), 1/3 to 5 oz (Outer)
Min. Hole Size (Drill Size) 0.20mm
Via Hole PTH (18:1, Max. Aspect Ratio), Buried Via
Min. Line Width/ Spacing 75 µm/ 75 (Inner) & 100 µm/ 100 µm (Outer)
Min. Micro BGA Pitch 0.75mm
Impedance Control +/- 8%

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