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| Quick Turn Around Services | |
| ¡¡ | 2019 |
| Layer Count | Up to 32L |
| Max. Panel Size | 458mmx 610mm |
| Base Materials | Low CTE/ High Tg FR-4, Halogen Free, BT Epoxy, Getek ML200, Nelco N400-13 EP/ SI, Rogers RO4350/ RO003C, Arlon 25FRm RF408, Megtron 4, Megtron 6, R1755V, Hitachi E679F(J)/ E679(W) |
| Min. Core Thickness | 50 µm |
| Copper Foil | 1/2 to 5 oz (Inner), 1/3 to 5 oz (Outer) |
| Min. Hole Size (Drill Size) | 0.20mm |
| Via Hole | PTH (18:1, Max. Aspect Ratio), Buried Via |
| Min. Line Width/ Spacing | 75 µm/ 75 (Inner) & 100 µm/ 100 µm (Outer) |
| Min. Micro BGA Pitch | 0.75mm |
| Impedance Control | +/- 8% |
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