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Capability - Backplane


2008

Layer Count

Up to 40 Layers

Minimum Line Width/ Space

3mil / 3mil

Aspect Ratio

16:1

Thickness Tolerance

+/- 8%

Minimum Core Thickness

2 mil

Maximum Panel size

24 " X 36 "

Maximum Board Thickness

236 mil (6mm)

Press fit hole tolerance

+/ -2 mil

Impedance Control

+/-7%




Conventional PCB Capability | Microvia Capability | Backplane Capability | High-end Server Capability | QTA Service Capability