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Capability - High-end Server


2008

Layer Count

Up to 40 Layers

Minimum Line Width/ Space

3 mil/ 3 mil

Aspect Ratio

18:1

Thickness Tolerance

+/- 8%

Minimum Core Thickness

2 mil

Copper Foil

1/3 oz to 5 oz

Maximum Panel size

24 " X 36 "

Maximum Board Thickness

236 mil (6mm)

Press fit hole tolerance

+/-2 mil

Impedance Control

+/-7%



Conventional PCB Capability | Microvia Capability | Backplane Capability | High-end Server Capability | QTA Service Capability