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P-138 (FR-4 IPC-4101)


P-124 (FR-4 IPC-4101)

MULTI-FUNCTIONAL EPOXY GLASS FABRIC COPPER CLAD LAMINATE

P-138 is a laminate with excellent dielectric properties, mechanical properties, chemical resistance and heat resistance, UV blocking and AOI compatible, having a Tg up to 135°C (DSC). Base material color: Yellow.

It is applicable for double sided or multilayer printed circuit board with higher performances.


General Specifications(1)

Thickness(2)
Inch (mm)

Copper Cladding
oz ( m)

Size(3)
Inch (mm)

Rigid laminate

0.0075 (0.2)

0.125 (3.2)

3/8 (12)

1/2 (18)

1 (35)

2 (70)

36" x 48" (920x1220)

37" x 49" (940x1245)

40" x 48" (1020x1220)

41" x 49" (1045x1245)

42" x 48" (1070x1220)

Thin Core
0.004 (0.1)

0.040 (1.0)

Property

Condition

Unit

Index

Typical value(4)

Glass transition temp Tg

DSC

°C

135

138

Surface resistance

After damp heat

C-96/35/90

M

104

106

At elevated temp

E-24/125

103

105

Volume resistivity

After damp heat

C-96/35/90

M-cm

106

107

¡¡

At elevated temp

E-24/125

103

105

Permittivity at 1 MHz

C-24/23/50

-

5.4

4.2

Loss tangent at 1 MHz

C-24/23/50

-

0.035

0.025

Dielectric breakdown

D-48/50

kV

40

50

Arc resistance

D-48/50

sec

60

110

Peel strength (1oz)

As received

A

N/mm

1.40

1.8

¡¡

After solder float

288°C 20s

1.40

1.8

Flexural strength

Lengthwise

A

N/mm2

415

480

¡¡

Crosswise

A

¡Ý 345

400

Dimensional stability X-Y axis

E-0.5/170

%

0.05

0.015

Water absorption

D-24/23

%

0.35

0.10

Solder float at 288°C

A

sec

20

120

Flammability

E-24/125

-

UL94V-0

UL94V-0

    1. Special requirements should be agreed by seller and buyer.

    2. Thickness tolerance meets IPC-4101 3.8.4.2 B/L level. Rigid board meets L level, thin core meets B level.

    3. Size available see (( GENERAL CHARACTERISTICS OF PIC COPPER CLAD LAMINATES (CCLs) )) -E.

    4. Typical value based on a 0.059" 1/1 (1.5mm 1/1) laminate.