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Application | LET RF Module |
Working panel size | 21.10’’x24.42’’ |
PCB size | 1.5748”x1.3386”(9 units/set) 5.9843’’x5.5906’’(set size) |
Min line W/S inner | 1.575/1.575 mil |
Min line W/S outer | 2.362/2.424 mil |
Min. burried Via (AR) | 0.2mm(2.0:1) |
Min. Via size(AR) | 0.3mm (3.0:1) |
Min. laser Via (AR) | 4mil (0.7 : 1) |
Surface finish | Immersion Au |
Board thickness | 0.89mm ±10% |
Laminate material | Doosan DS-7402 |
Special Features | 10 Layer HDI 4 times lamination |