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E&E PN | I-D8W1499 |
Application | Mobile phone |
Min line W/S inner | 1.57/1.97mil |
Min line W/S outer | 1.97/2.75mil |
Min. Via size | 0.2mm |
Min. laser Via | 0.09mm |
Surface finish | IMG+OSP |
Board thickness | 0.65mm |
Laminate material | EM-370(5) |

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