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E&E PN
I-D8W1499
Application
Mobile phone
Min line W/S inner
1.57/1.97mil
Min line W/S outer
1.97/2.75mil
Min. Via size
0.2mm
Min. laser Via
0.09mm
Surface finish
IMG+OSP
Board thickness
0.65mm
Laminate material
EM-370(5)
